This product is a high-quality 4-layer printed circuit board (PCB)

with OSP surface finish, designed for cost-effective, high-reliability electronic applications.

The 4-layer stack-up provides stable signal routing and improved EMI performance, while the OSP coating protects copper pads from oxidation and ensures excellent short-term solderability during assembly.

Key Features

4-layer multilayer structure: Balanced performance for signal, power, and ground distribution

OSP surface finish (Organic Solderability Preservative): Thin organic coating for copper protection

Excellent solderability: Ideal for SMT and reflow soldering processes

Flat surface design: Suitable for fine-pitch and high-density components

Cost-effective solution: Lower surface treatment cost compared to ENIG or HASL

Environmentally friendly: Lead-free and RoHS compliant process

Technical Specifications

Layer count: 4 layers

Base material: FR-4 / high-Tg FR-4 (optional)

Surface finish: OSP (Organic Solderability Preservative)

OSP thickness: 0.2–0.5 μm (typical)

Copper thickness: 1 oz / 2 oz (customizable)

Board thickness: 0.6 mm – 2.4 mm

Minimum trace/space: 4/4 mil (depending on capability)

Operating temperature: -40°C to 130°C (standard FR-4)

Shelf life (before soldering): 3–6 months under proper storage conditions

Applications

Consumer electronics (smart devices, home appliances)

LED lighting systems

Industrial control boards

Communication modules

Power management circuits

Automotive electronic components (non-critical systems)

Advantages

Compared with HASL or ENIG finishes, OSP 4-layer PCBs offer:

Lower manufacturing cost for mass production

Very flat surface for fine-pitch SMT assembly

Good solderability for short production cycles

Reduced environmental impact due to organic coating

Reliable performance for medium-complexity circuits

Customization Options

Material selection (FR-4, high-Tg FR-4)

Layer stack-up design optimization

Copper thickness adjustment

Solder mask color options (green, black, blue, red, white)

Board thickness and impedance control

Panelization and assembly support

Quality Assurance

Each PCB is strictly tested to ensure production stability and performance:

Electrical test (E-test) for continuity and insulation

AOI (Automated Optical Inspection)

Impedance control testing (if required)

Solderability verification

Dimensional accuracy inspection

Microsection analysis (for quality verification)