Product Overview

This product is a 6-layer electroplated metal PCB (metal-based multilayer circuit board) designed for high-power, high-thermal-demand electronic applications. The metal core combined with electroplated surface technology provides excellent heat dissipation, mechanical strength, and electrical stability, making it ideal for advanced industrial and power electronics systems.

Key Features

6-layer multilayer structure: Supports complex routing and high-density circuit design

Electroplated metal surface treatment: Enhances conductivity, corrosion resistance, and solder reliability

Metal core base (Aluminum or Copper optional): Excellent thermal dissipation performance

High power handling capability: Suitable for high-current and high-heat applications

Strong mechanical stability: Resistant to vibration and thermal stress

Reliable electrical performance: Stable signal transmission for power and control circuits

Technical Specifications

Layer count: 6 layers

Base material: Aluminum / Copper metal core (customizable)

Surface treatment: Electroplating (Nickel / Tin / Gold optional combinations)

Copper thickness: 1 oz – 3 oz (customizable)

Board thickness: 0.8 mm – 3.5 mm (depending on structure)

Thermal conductivity: High (depends on metal core type)

Operating temperature range: -40°C to 150°C

Minimum trace/space: 3/3 mil (varies by design capability)

Applications

High-power LED lighting systems

Automotive power control modules

Industrial power supplies

Motor drivers and inverters

Communication power amplifiers

Renewable energy systems (solar / wind converters)

High-heat-density electronic assemblies

Advantages

Compared with standard FR-4 PCBs, this electroplated metal PCB offers:

Superior heat dissipation for high-power operation

Improved lifespan under thermal cycling conditions

Stronger mechanical durability and shock resistance

Better reliability for high-current transmission

Reduced risk of overheating and delamination

Customization Options

Metal core selection (Aluminum / Copper / hybrid structures)

Electroplating type (Ni / Sn / Au / selective plating)

Layer stack-up design optimization

Copper thickness and impedance control

Thermal interface structure customization

Surface solder mask color options

Quality Assurance

Each board is strictly tested to ensure high reliability, including:

Electrical continuity and insulation testing (E-test)

Thermal performance validation

Cross-section analysis

Surface plating thickness inspection

AOI (Automated Optical Inspection)

High-temperature aging and stress testing