Product Overview

This product is a high-performance 4-layer printed circuit board (PCB)

with gold-plated surface finish, designed for applications requiring excellent electrical performance, signal integrity, and long-term reliability. The 4-layer structure ensures stable power distribution and optimized routing, while the gold plating enhances corrosion resistance and contact conductivity.

Key Features

4-layer multilayer design: Supports stable signal, power, and ground separation

Gold-plated surface finish (ENIG / optional hard gold): Excellent oxidation resistance and conductivity

High reliability performance: Suitable for demanding electronic applications

Superior solderability: Ensures stable SMT and reflow assembly

Excellent surface flatness: Ideal for fine-pitch components and BGA mounting

Long service life: Maintains stable performance in harsh environments

Technical Specifications

Layer count: 4 layers

Base material: FR-4 / high-Tg FR-4 (optional)

Surface finish: ENIG (Electroless Nickel Immersion Gold) / hard gold optional

Gold thickness: 0.03–2.0 μm (customizable)

Nickel thickness: 3–6 μm (typical ENIG structure)

Copper thickness: 1 oz / 2 oz (customizable)

Board thickness: 0.6 mm – 2.4 mm

Minimum trace/space: 4/4 mil (depending on capability)

Operating temperature: -40°C to 125°C (standard FR-4)

Applications

Communication devices and network equipment

Industrial control systems

Automotive electronics

Medical devices

Consumer electronics

Embedded control modules

High-reliability instrumentation

Advantages

Compared with OSP or HASL finishes, this gold-plated 4-layer PCB provides:

Superior oxidation resistance and storage stability

Improved contact reliability for edge connectors and keypads

Enhanced performance in high-frequency or precision circuits

Better surface flatness for fine-pitch assembly

Longer shelf life before and after assembly

Customization Options

Material selection (FR-4, high-Tg, etc.)

Surface finish options (ENIG, hard gold, selective gold plating)

Stack-up design optimization

Copper thickness and impedance control

Board thickness and stiffness requirements

Solder mask color options (green, black, blue, red, white)

Quality Assurance

Each PCB is manufactured under strict quality control standards, including:

Electrical testing (E-test)

AOI (Automated Optical Inspection)

Microsection analysis

Solderability testing

Surface finish thickness measurement

Impedance and continuity verification (if required)