Product Overview

This product is a high-reliability 6-layer printed circuit board (PCB)

with gold-plated surface finish, designed for advanced electronic

applications requiring excellent signal integrity, durability, and

corrosion resistance. The multilayer structure enables complex circuit

routing, while the gold plating ensures superior conductivity and long-term surface stability.

Key Features

6-layer multilayer design: Supports high-density and complex circuit layouts

Gold-plated surface finish (ENIG / hard gold optional): Excellent conductivity and oxidation resistance

High signal integrity: Reduced interference for high-frequency applications

Strong durability: Suitable for long-term and harsh operating environments

Excellent solderability: Reliable SMT and through-hole assembly performance

Precision manufacturing: Tight tolerance control for advanced electronics

Technical Specifications

Layer count: 6 layers

Base material: FR-4 / high-Tg FR-4 / Rogers (optional)

Surface finish: ENIG (Electroless Nickel Immersion Gold) / hard gold optional

Gold thickness: 0.03–2.0 μm (customizable)

Copper thickness: 1 oz / 2 oz (customizable)

Minimum trace/space: 3/3 mil (depending on design capability)

Board thickness: 0.6 mm – 3.2 mm

Operating temperature: -40°C to 125°C (standard FR-4)

Applications

Communication equipment and RF modules

Industrial control systems

Medical electronic devices

Automotive electronics

Aerospace and defense systems

High-performance computing hardware

Precision instrumentation

Advantages

Compared with standard HASL or bare copper boards, this gold-plated 6-layer PCB offers:

Better oxidation resistance and longer shelf life

Improved contact reliability for edge connectors and signal paths

Enhanced performance in high-frequency and high-speed circuits

Superior surface flatness for fine-pitch components

Greater durability in demanding environments

Customization Options

Layer stack-up design optimization

Material selection (FR-4, high-Tg, Rogers, etc.)

Surface finish options (ENIG, hard gold, selective gold plating)

Board thickness and copper weight

Impedance control (single-ended/differential)

Solder mask color (green, black, blue, red, white)

Quality Assurance

Each batch is manufactured under strict quality control standards, including:

Electrical testing (E-test)

AOI (Automated Optical Inspection)

Microsection analysis

Impedance and continuity testing

Surface finish thickness inspection