Product Overview
This product is a single-sided aluminum-based substrate treated with OSP (Organic Solderability Preservative).
It is designed to provide excellent solderability while maintaining the lightweight, high thermal conductivity properties of aluminum.
The OSP coating forms a thin, organic protective layer that prevents oxidation and ensures reliable surface performance during PCB assembly processes.
Key Features
Aluminum-based structure: Lightweight with outstanding heat dissipation capability
Single-sided OSP coating: Protects copper-free aluminum surface from oxidation
Excellent solderability: Ensures stable and reliable SMT and reflow soldering performance
Flat and uniform surface: Suitable for high-precision electronic assembly
Environmentally friendly process: Lead-free and RoHS compliant
Cost-efficient solution: Ideal for high-volume production
Technical Specifications
Base material: Aluminum alloy (custom grades available)
Surface treatment: Single-sided OSP (Organic Solderability Preservative)
Coating thickness: 0.2–0.5 μm (typical)
Surface appearance: Transparent organic protective layer
Thermal conductivity: High (dependent on aluminum alloy type)
Operating temperature range: -40°C to 130°C (typical)
Storage life (before soldering): 3–6 months under proper conditions
Applications
LED lighting modules and heat dissipation boards
Power electronics and control modules
Automotive electronic systems
Consumer electronics assembly
communication equipment
Industrial automation devices
Advantages
Compared with bare aluminum or other surface treatments, OSP-coated aluminum substrates offer:
Improved short-term solderability performance
Reduced oxidation risk during storage and assembly
Smooth surface suitable for fine-pitch components
Stable performance in SMT and reflow processes
Environmentally safe surface finishing solution
Customization Options
Aluminum alloy grade selection
Substrate thickness and dimensions
Single-sided or selective OSP coating
Surface roughness control
Packaging and anti-oxidation storage solutions
Quality Assurance
Each product batch is tested for:
OSP coating uniformity
Solderability performance (wetting tests)
Surface cleanliness and contamination control
Dimensional accuracy
Thermal stability performance
