Comparison of Advantages and Disadvantages of Hard and Soft CCL

Hard Copper Clad Laminate

Advantages: Low thermal expansion, no deformation at high temperatures, stable dimensions, high heat TG resistance, not prone to stretching, suitable for high-precision circuit boards (IC carrier boards, high-frequency boards, automotive PCBs)

Disadvantages: Poor toughness, prone to cracking when bent, resin powder easily generated during drilling, easy to chip during punching

Soft Copper Clad Laminate (low Tg, high adhesive, thin glass fiber)

Advantages: Easy to drill holes during processing, slightly bendable, smooth punching and cutting, less prone to chipping

Disadvantages: Likely to warp at high temperatures, high thermal expansion, high-precision circuits prone to deviation, low heat resistance level